Si submount

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Three typical semiinsulating silicon submounts with Pb-Sn bonding areas for surface emitting mid-IR LEDs and backside-illuminated photodiodes (“flip chip bonding”or S -type)
Chip view

Episide down bonded LED chip onto Si submount (t=180⁰C). LED with Si submount can be soldered to a header (heatsink) at 160^oC

Three typical semiinsulating silicon submounts with Pb-Sn bonding areas for surface emitting mid-IR LEDs and backside-illuminated photodiodes (“flip chip bonding”or S -type)